
Hexion Major Resins
Hexion Major Resins consist of basic liquid epoxy resins, solid epoxy resins, powder coating solid resins and commodity solutions.
Basic Liquid Epoxy Resins | |
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Product Name / Code | Description |
Epon 826 | A low viscosity Bisphenol A liquid resin |
Epon 828 | Predominant standard liquid epoxy product. |
Epon 830 | Higher molecular weight liquid epoxy. |
Epon 862 | A low viscosity liquid epoxy resin manufactured from epichlorohydrin and Bisphenol F. |
Solid Epoxy Resins | |
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Product Name / Code | Description |
Epon 1001F | A low molecular weight solid epoxy resin derived from liquid epoxy resin and Bisphenol A. |
Epon 1002F | A solid epoxy resin derived from liquid epoxy resin and Bisphenol A. |
Epon 1004F | A solid epoxy resin derived from Bisphenol A and epichlorohydrin. |
Epon 1007F | A moderately high molecular weight solid epoxy resin derived from liquid epoxy resin and Bisphenol A. |
Epon 1007 CT-55 | A solid epoxy resin. It contains 55% solids in methyl isobutyl ketone (MIBK)/toluene. |
Epon 1009F | A very high molecular weight solid epoxy resin Derived from liquid epoxy resin and Bisphenol A |
Epon 3002 | A low viscosity solid epoxy resin designed for Use in electrical encapsulating powders. |
Powder Coating Solid Resins | |
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Product Name / Code | Description |
Epon 2002 | A solid Bisphenol A/epichlorohydrin epoxy resin for thin-film functional and decorative epoxy powder coatings. |
Epon 2003 | A solid Bisphenol A/epichlorohydrin epoxy for both thick-film functional and thin film decorative epoxy powder coatings. |
Epon 2004 | A solid Bisphenol A/epichlorohydrin epoxy for both thick-film functional and thin film decorative epoxy powder coatings. |
Epon 2005 | A fusion derived solid Bisphenol A/epichlorohydrin epoxy for both thick-film functional and intermediate film thickness decorative epoxy powder coatings. |
Epon 2014 | A fusion derived solid Bisphenol A/epichlorohydrin epoxy resin that is blended with an epoxy phenolic novolac resin for functional and Decorative epoxy powder coatings. |
Commodity Solutions | |
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Product Name / Code | Description |
Epon 8280 | For formulating filled compounds for a variety of structural applications including bonding, electrical encapsulation, tooling, flooring and most construction applications. |